{"id":3702,"date":"2026-08-29T10:00:00","date_gmt":"2026-08-29T10:00:00","guid":{"rendered":"https:\/\/xinshun.51sanhao.com\/hotel-hvac-energy-optimization-guide\/"},"modified":"2026-08-30T02:35:08","modified_gmt":"2026-08-30T02:35:08","slug":"micro-bga-reflow-tuning-to-reduce-solder-voids","status":"publish","type":"blog","link":"https:\/\/xinshun.51sanhao.com\/zh\/micro-bga-reflow-tuning-to-reduce-solder-voids\/","title":{"rendered":"Micro-BGA Reflow Tuning to Reduce Solder Voids"},"content":{"rendered":"<p>Micro-BGA Reflow Tuning to Reduce Solder Voids looks at nitrogen profiles, stencil control, and void reduction.<\/p>\n<p>This article highlights practical steps that help PCB and PCBA teams keep designs manufacturable, reliable, and ready for production.<\/p>","protected":false},"excerpt":{"rendered":"<p>A practical look at nitrogen profiles, stencil control, and void reduction.<\/p>","protected":false},"featured_media":3784,"menu_order":9,"template":"","blog_category":[51],"class_list":["post-3702","blog","type-blog","status-publish","has-post-thumbnail","hentry","blog_category-knowledge"],"_links":{"self":[{"href":"https:\/\/xinshun.51sanhao.com\/zh\/wp-json\/wp\/v2\/blog\/3702","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/xinshun.51sanhao.com\/zh\/wp-json\/wp\/v2\/blog"}],"about":[{"href":"https:\/\/xinshun.51sanhao.com\/zh\/wp-json\/wp\/v2\/types\/blog"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/xinshun.51sanhao.com\/zh\/wp-json\/wp\/v2\/media\/3784"}],"wp:attachment":[{"href":"https:\/\/xinshun.51sanhao.com\/zh\/wp-json\/wp\/v2\/media?parent=3702"}],"wp:term":[{"taxonomy":"blog_category","embeddable":true,"href":"https:\/\/xinshun.51sanhao.com\/zh\/wp-json\/wp\/v2\/blog_category?post=3702"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}