Rigid PCB
1-56 layers; FR-4, high-Tg, halogen-free; 3 mil line/space; up to 12 oz copper; controlled impedance.
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Precision PCB Fabrication & Turnkey PCBA Manufacturing Capabilities
Explore XINSHUNPCB's precision manufacturing thresholds and assembly limits. From 32-layer Any-Layer HDI and 10oz heavy copper power boards to 01005 micro-component placement and 0.2 mm fine-pitch BGA assembly, we deliver IPC Class 3 reliability, 100% franchised BOM sourcing, and turnkey box-build execution for mission-critical hardware.
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Hand over the whole board - not just
Most projects lose time and accountability in the gap between the fab house and the assembly house. XINSHUNPCB closes that gap: we fabricate the bare PCB and populate it under one roof, with one team answering for the result.
- ✓ PCB fabrication + SMT/PTH assembly in the same facility - no shipping between vendors.
- ✓ Single point of accountability from Gerber to finished, tested board.
- ✓ Prototype to volume on the same line, with quick-turn options.
Every board technology, built in-house
From standard FR-4 to demanding HDI, RF and metal-core constructions - explore each capability in detail.
Flex PCB
1-12 layers; polyimide / PET; static and dynamic flex; stiffeners; ENIG and electro-gold finishes.
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Rigid-Flex PCB
2-32 layers; rigid and flex zones in one board; IPC-6013; compact, high-reliability integration.
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HDI PCB
Any-layer; laser microvia 0.1 mm; 1+N+1 to 4+N+4; stacked and staggered vias; VIPPO.
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Metal-Core PCB
Aluminium / copper / iron core; high thermal conductivity; LED, power, and automotive lighting applications.
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SMT Assembly
4M placements/day; 01005 and 0.2 mm BGA pitch; PoP and flip-chip; turnkey or consigned.
View capabilityThe factory and labs behind the boards
High-end results come from high-end tooling and real, in-house testing. Step inside.
PCB manufacturing line
LDI imaging, laser drilling, VCP plating, X-ray registration, AOI and flying-probe test.
SMT assembly line
Solder-paste printing, 3D SPI, high-speed placement, nitrogen reflow, AOI, X-ray and ICT.
Physics & chemistry labs
20+ instruments - microsection, plating thickness, impedance, ionic cleanliness and thermal stress.
PCBA & RF testing
SPI, AOI, X-ray, ICT and functional test - plus a dedicated RF / microwave and Dk/Df material lab.
We build with your engineers, not just for them
From a first prototype to a qualified product, our engineers stay involved - reviewing the design, advising on materials and stackup, and proving the board in our own laboratories before you commit to volume.
- ✓ DFM & DFA feedback on every quote - manufacturability before you tool up.
- ✓ Stackup, impedance & material advice for HDI, RF and high-speed designs.
- ✓ Lab access for design verification - reliability, RF and thermal testing on real samples.
- ✓ NDA on request - your IP stays yours.
From your files to a tested board
A controlled, traceable flow - with inspection and test built in at every stage, not bolted on at the end.
1
Design & DFM
Gerber / BOM review, manufacturability & stackup check.
2
PCB fabrication
Imaging, drilling, plating, solder mask & finish.
3
Bare-board test
AOI, 100% electrical test & lab verification.
4
SMT / PTH assembly
Print, place, reflow, wave & selective solder.
5
Inspection & test
SPI, AOI, X-ray, ICT & functional test.
6
Box-build & ship
Assembly, final QC, packaging & delivery.
Certified, documented, traceable
Every board is built and tested to recognized standards, with full traceability and data retention.
ISO 9001
UL listed
IPC-A-600
IPC-A-610 Class 2 & 3
J-STD-001
RoHS / REACH
IATF 16949-capable
ISO 13485-capable
AS9100-capable
Trusted across demanding industries
Medical
Class 3 reliability
Automotive
IATF-capable
Aerospace
AS9100-capable
Telecom / 5G
RF & high-speed
Industrial
Power & control
LED & Power
Metal-core PCB
Consumer
High-mix volume
RF / Microwave
Rogers · Taconic
Sector-Specific Turnkey Manufacturing Solutions
Tailored engineering execution and IPC Class 3 manufacturing for high-stakes industries where failure is not an option.
Industrial & Power Electronics
Engineered to withstand massive electrical currents, thermal stress, and continuous mechanical vibration. XinshunPCB delivers IPC Class 3 heavy copper boards, high-thermal metal-core solutions, and turnkey SMT assemblies for grid-scale energy storage, industrial robotics, motor drives, and solar inverters.
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Medical Equipment
Traceable, high-reliability PCB fabrication and PCBA assembly for diagnostic devices, monitors, analyzers, and other healthcare equipment requiring stable performance and strict quality control.
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Automotive Electronic
Engineered for vehicle control, sensing, infotainment, and power management systems exposed to vibration, thermal cycling, and long service life requirements.
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Telecommunications & IoT
Low-loss, impedance-controlled circuit solutions for RF, 5G, networking, gateways, and connected devices that demand stable high-frequency transmission.
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Rigid-Flex PCB
Space-saving rigid-flex interconnects for compact products that need reliable routing, dynamic bend performance, and reduced wiring complexity.
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Metal-Core PCB
Thermal-intensive PCB fabrication and assembly for LED power, high-current, automotive lighting, and industrial electronics requiring efficient heat dissipation.
Explore SolutionCapabilities & Manufacturing Limits FAQ
Technical answers to common engineering questions regarding manufacturing thresholds, assembly tolerances, DFM reviews, and quality verification standards.
Q1 What quality standards guide XinshunPCB production? + -
Our work is guided by disciplined process control, customer requirements, and the quality systems needed for reliable PCB and PCBA delivery.
Q2 How do you keep lead times stable during supply fluctuations? + -
We protect lead times with planning, sourcing visibility, approved alternates, and early communication when constrained parts need attention.
Q3 Why is traceability important in PCB manufacturing? + -
Traceability links materials, process steps, and inspections so quality events can be found quickly and root causes can be isolated with confidence.
Q4 How do you balance cost and performance in stackup selection? + -
We compare signal, thermal, and reliability needs against material and layer cost, then choose the simplest stackup that still meets the spec.
Q5 What should a production-ready PCB design review include? + -
A production-ready review should check stackup, spacing, drill data, polarity, assembly fit, test access, and any special reliability requirements.
Q6 How do you control warpage on large or thin PCBs? + -
We manage warpage with balanced stackups, careful lamination, panel planning, and process rules that reduce mechanical stress.
Ready to Power Your Next Commercial Project?
Request a tailored technical proposal or custom pricing index today. Our engineering experts will review your specifications and respond within 24 hours with actionable topology blueprints.
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Your commercial inquiries, project blueprints, and intellectual property are fully protected by strict confidentiality compliance.
24-Hour R&D Engineer Alignment
Skip the basic customer service. Your technical specifications are directly evaluated by Xinshun’s senior R&D and system architecture teams.
Factory-Direct Commercial Advantage
Gain direct access to source manufacturing pricing, rigorous 24/7 full-load aging tests, and full life-cycle tech support.