Precision placement
Fine-pitch and mixed-technology placement aligned to your BOM and stencil data.
Placement
SMT Assembly capabilities
Turnkey PCBA assembly from BOM sourcing and stencil printing to high-speed SMT, through-hole soldering, inspection, functional testing, and box-build.
Get Instant SMT Assembly QuoteSMT Assembly specifications
Two capability tiers for repeatable, high-yield volume and an extended prototype window for pushing the limits. Need something beyond these? Ask us - we build to spec.
Layers & dimensions
| Feature / Parameter | Mass production | Prototype (extended) |
|---|---|---|
| Placement precision | 01005 / 0.2 mm BGA | 01005 / 0.2 mm BGA |
| Max. panel size | 600 x 770 mm | 600 x 770 mm |
| Min. board thickness | 0.3 mm | 0.1 mm |
Lines & spacing
| Feature / Parameter | Mass production | Prototype (extended) |
|---|---|---|
| Min. line width | 3 mil (0.075 mm) | 3 mil (0.075 mm) |
| Min. line space | 3 mil (0.075 mm) | 3 mil (0.075 mm) |
Electrical & reliability
| Feature / Parameter | Mass production | Prototype (extended) |
|---|---|---|
| Controlled impedance | +/-10% | +/-7% |
| Thermal shock | 288C x 3 x 10 sec | 288C x 3 x 10 sec |
| Warp & twist | 0.7% | 0.7% |
Have a rigid board to build?
Send your Gerbers and stackup - our engineers confirm manufacturability against this spec and reply with a quote, usually within 24 hours, plus a free DFM review.
Request a QuoteAdvanced & high-end rigid processes
When your design pushes the envelope, our advanced process toolkit keeps it manufacturable and reliable.
Through-hole support
Wave, selective, and manual soldering for mixed PCB assemblies.
PTH ready
Component sourcing
Original component sourcing to reduce procurement risk and counterfeit exposure.
Supply chain
Inspection flow
SPI, AOI, X-ray, ICT, and functional testing for assembly confidence.
Quality gate
Box build
Final integration, enclosure work, and packaging under one controlled process.
System build
Build traceability
Lot, date, and test records retained with the assembly history.
TraceableStandards we build & test to
Every board is fabricated, inspected and documented to recognized industry standards.
IPC-6012
Rigid board - Class 2 & 3
IPC-A-600
Acceptability of boards
ISO 9001
Quality management
UL
Listed 94V-0
RoHS / REACH
EU compliant
Traceability
Lot & date control
J-STD-001
Soldering-ready
ISO 13485
Medical-capable
IATF 16949
Automotive-capable
AS9100
Aerospace-capable
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Explore SolutionCapabilities & Manufacturing Limits FAQ
Technical answers to common engineering questions regarding this capability, inspection flow, and delivery expectations.
Q1 What quality standards guide XinshunPCB production? + -
Our work is guided by disciplined process control, customer requirements, and the quality systems needed for reliable PCB and PCBA delivery.
Q2 How do you keep lead times stable during supply fluctuations? + -
We protect lead times with planning, sourcing visibility, approved alternates, and early communication when constrained parts need attention.
Q3 Why is traceability important in PCB manufacturing? + -
Traceability links materials, process steps, and inspections so quality events can be found quickly and root causes can be isolated with confidence.
Q4 How do you balance cost and performance in stackup selection? + -
We compare signal, thermal, and reliability needs against material and layer cost, then choose the simplest stackup that still meets the spec.
Q5 What should a production-ready PCB design review include? + -
A production-ready review should check stackup, spacing, drill data, polarity, assembly fit, test access, and any special reliability requirements.
Q6 How do you control warpage on large or thin PCBs? + -
We manage warpage with balanced stackups, careful lamination, panel planning, and process rules that reduce mechanical stress.
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