Material selection
Polyimide stackups, adhesive systems, and thickness choices tuned for the required bend profile.
Flex-ready
Flex PCB capabilities
Ultra-thin flexible circuits engineered for dynamic bending, compact wearable electronics, medical devices, camera modules, and space-constrained interconnects.
Get Instant Flex PCB QuoteFlex PCB specifications
Two capability tiers for repeatable, high-yield volume and an extended prototype window for pushing the limits. Need something beyond these? Ask us - we build to spec.
Layers & dimensions
| Feature / Parameter | Mass production | Prototype (extended) |
|---|---|---|
| Layer count | 1-8 layers | 1-12 layers |
| Max. panel size | 600 x 770 mm | 600 x 770 mm |
| Min. board thickness | 0.3 mm | 0.1 mm |
Lines & spacing
| Feature / Parameter | Mass production | Prototype (extended) |
|---|---|---|
| Min. line width | 3 mil (0.075 mm) | 3 mil (0.075 mm) |
| Min. line space | 3 mil (0.075 mm) | 3 mil (0.075 mm) |
Electrical & reliability
| Feature / Parameter | Mass production | Prototype (extended) |
|---|---|---|
| Controlled impedance | +/-10% | +/-7% |
| Thermal shock | 288C x 3 x 10 sec | 288C x 3 x 10 sec |
| Warp & twist | 0.7% | 0.7% |
Have a rigid board to build?
Send your Gerbers and stackup - our engineers confirm manufacturability against this spec and reply with a quote, usually within 24 hours, plus a free DFM review.
Request a QuoteAdvanced & high-end rigid processes
When your design pushes the envelope, our advanced process toolkit keeps it manufacturable and reliable.
Dynamic flexing
Repeated bend cycles validated for motion-driven assemblies and moving interconnects.
Cycle tested
Stiffeners & ZIF zones
Reinforced connector areas for robust assembly and repeatable insertion performance.
Assembly support
EMI shielding
Shielding film and grounded structures for sensitive mixed-signal flex assemblies.
Noise control
Controlled impedance
Trace geometry and stackup tuned for predictable signal behavior through flex regions.
Signal integrity
Final validation
Visual, electrical, and mechanical checks before release to production.
Quality gateStandards we build & test to
Every board is fabricated, inspected and documented to recognized industry standards.
IPC-6012
Rigid board - Class 2 & 3
IPC-A-600
Acceptability of boards
ISO 9001
Quality management
UL
Listed 94V-0
RoHS / REACH
EU compliant
Traceability
Lot & date control
J-STD-001
Soldering-ready
ISO 13485
Medical-capable
IATF 16949
Automotive-capable
AS9100
Aerospace-capable
Related Solutions
Explore selected solution pages related to this manufacturing capability.
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Medical Equipment
Traceable, high-reliability PCB fabrication and PCBA assembly for diagnostic devices, monitors, analyzers, and other healthcare equipment requiring stable performance and strict quality control.
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Automotive Electronic
Engineered for vehicle control, sensing, infotainment, and power management systems exposed to vibration, thermal cycling, and long service life requirements.
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Telecommunications & IoT
Low-loss, impedance-controlled circuit solutions for RF, 5G, networking, gateways, and connected devices that demand stable high-frequency transmission.
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Rigid-Flex PCB
Space-saving rigid-flex interconnects for compact products that need reliable routing, dynamic bend performance, and reduced wiring complexity.
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Thermal-intensive PCB fabrication and assembly for LED power, high-current, automotive lighting, and industrial electronics requiring efficient heat dissipation.
Explore SolutionCapabilities & Manufacturing Limits FAQ
Technical answers to common engineering questions regarding this capability, inspection flow, and delivery expectations.
Q1 What quality standards guide XinshunPCB production? + -
Our work is guided by disciplined process control, customer requirements, and the quality systems needed for reliable PCB and PCBA delivery.
Q2 How do you keep lead times stable during supply fluctuations? + -
We protect lead times with planning, sourcing visibility, approved alternates, and early communication when constrained parts need attention.
Q3 Why is traceability important in PCB manufacturing? + -
Traceability links materials, process steps, and inspections so quality events can be found quickly and root causes can be isolated with confidence.
Q4 How do you balance cost and performance in stackup selection? + -
We compare signal, thermal, and reliability needs against material and layer cost, then choose the simplest stackup that still meets the spec.
Q5 What should a production-ready PCB design review include? + -
A production-ready review should check stackup, spacing, drill data, polarity, assembly fit, test access, and any special reliability requirements.
Q6 How do you control warpage on large or thin PCBs? + -
We manage warpage with balanced stackups, careful lamination, panel planning, and process rules that reduce mechanical stress.
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