Our high-speed automated placement lines (Panasonic NPM / Yamaha YSM series) achieve high-accuracy placement with repeatability within ±0.03 mm (Cpk ≥ 1.33). We reliably assemble micro passives down to 01005 (0402 metric) and fine-pitch packages down to 0.30 mm pitch micro-BGAs, WLCSPs, and 0.35 mm pitch QFNs. Lead coplanarity and component alignment are verified in real time using multi-angle laser optical sensors prior to board touch-down.

We enforce a three-tier inline automated quality inspection process to intercept defects before they can propagate:
In-Line 3D SPI (Solder Paste Inspection): Measures 100% of solder paste deposit volume, height, area, and coplanarity immediately after stencil printing, intercepting paste bridging or insufficient volume.
In-Line 3D AOI (Automated Optical Inspection): Inspects post-reflow component presence, polarity, alignment skew, tombstoning, and solder joint wetting using multi-frequency structured light.
High-Resolution 3D Micro-Focus X-Ray: Penetrates non-visible joints beneath BGA, CSP, and QFN packages to inspect internal wetting, bridging, and solder ball void percentages.

IPC-A-610 Class 3 limits BGA voiding to ≤ 15%. XinshunPCB typically suppresses voiding to < 8% to 10%. We accomplish this through: (1) Designing laser-cut electro-polished stencils with optimized aperture patterns (window pane cross-hatching for ground slugs); (2) Formulating high-activity, low-voiding Type 4/Type 5 solder pastes; and (3) Running multi-zone reflow ovens under a controlled Nitrogen (N2) atmosphere (< 100 ppm O2 residual) with tailored thermal soak zones to facilitate complete flux degassing prior to liquidus transition.

To ensure zero out-of-box failures, we offer a comprehensive testing suite tailored to project complexity:
In-Circuit Testing (ICT): Bed-of-nails electrical fixtures verifying component values, tolerances, and circuit continuity.
Flying Probe Testing (FPT): Fixtureless electrical testing suitable for high-density prototypes and small batches.
Functional Circuit Testing (FCT): Custom test jigs powering up the board to execute automated firmware loading, I/O signal simulation, RF calibration, and communication bus checks.
Environmental Stress Screening (ESS): Thermal cycling, burn-in chamber testing, and multi-axis vibration testing.

Yes. We operate automated selective conformal coating lines (Nordson Asymtek) dispensing acrylic, silicone, polyurethane, or UV-cure materials with precision robotic spray needles. Automated dispensing protects sensitive circuitry against moisture, salt spray, chemical ingress, and dust without contaminating test points, connectors, or optical sensors. Coating thickness is verified under black light (UV) inspection to guarantee bubble-free, uniform surface encapsulation.