Any-layer architecture
Dense interconnect strategy for high-pin-count layouts and compact form factors.
HDI-ready
HDI PCB capabilities
High-density interconnect fabrication for fine-pitch components, compact devices, high-speed digital systems, and complex routing requirements.
Get Instant HDI PCB QuoteHDI PCB specifications
Two capability tiers for repeatable, high-yield volume and an extended prototype window for pushing the limits. Need something beyond these? Ask us - we build to spec.
Layers & dimensions
| Feature / Parameter | Mass production | Prototype (extended) |
|---|---|---|
| Microvia diameter | 0.1 mm | 0.1 mm |
| Max. panel size | 600 x 770 mm | 600 x 770 mm |
| Min. board thickness | 0.3 mm | 0.1 mm |
Lines & spacing
| Feature / Parameter | Mass production | Prototype (extended) |
|---|---|---|
| Min. line width | 3 mil (0.075 mm) | 3 mil (0.075 mm) |
| Min. line space | 3 mil (0.075 mm) | 3 mil (0.075 mm) |
Electrical & reliability
| Feature / Parameter | Mass production | Prototype (extended) |
|---|---|---|
| Controlled impedance | +/-10% | +/-7% |
| Thermal shock | 288C x 3 x 10 sec | 288C x 3 x 10 sec |
| Warp & twist | 0.7% | 0.7% |
Have a rigid board to build?
Send your Gerbers and stackup - our engineers confirm manufacturability against this spec and reply with a quote, usually within 24 hours, plus a free DFM review.
询价Advanced & high-end rigid processes
When your design pushes the envelope, our advanced process toolkit keeps it manufacturable and reliable.
Via-in-pad & filling
Microvia structures and filled vias to support fine-pitch BGA escape routing.
Microvia focus
Stacked structures
Stacked and staggered via combinations aligned to the required routing density.
Dense routing
Controlled impedance
Impedance-controlled traces verified for high-speed and RF signal chains.
Signal integrity
Process verification
AOI, X-ray, and electrical inspection to keep HDI builds repeatable.
Verified
Prototype support
Quick-turn samples for stackup validation before production release.
NPI supportStandards we build & test to
Every board is fabricated, inspected and documented to recognized industry standards.
IPC-6012
Rigid board - Class 2 & 3
IPC-A-600
Acceptability of boards
ISO 9001
Quality management
UL
Listed 94V-0
RoHS / REACH
EU compliant
Traceability
Lot & date control
J-STD-001
Soldering-ready
ISO 13485
Medical-capable
IATF 16949
Automotive-capable
AS9100
Aerospace-capable
Related Solutions
Explore selected solution pages related to this manufacturing capability.
Industrial & Power Electronics
Engineered to withstand massive electrical currents, thermal stress, and continuous mechanical vibration. XinshunPCB delivers IPC Class 3 heavy copper boards, high-thermal metal-core solutions, and turnkey SMT assemblies for grid-scale energy storage, industrial robotics, motor drives, and solar inverters.
Explore Solution
Medical Equipment
Traceable, high-reliability PCB fabrication and PCBA assembly for diagnostic devices, monitors, analyzers, and other healthcare equipment requiring stable performance and strict quality control.
Explore Solution
Automotive Electronic
Engineered for vehicle control, sensing, infotainment, and power management systems exposed to vibration, thermal cycling, and long service life requirements.
Explore Solution
Telecommunications & IoT
Low-loss, impedance-controlled circuit solutions for RF, 5G, networking, gateways, and connected devices that demand stable high-frequency transmission.
Explore Solution
Rigid-Flex PCB
Space-saving rigid-flex interconnects for compact products that need reliable routing, dynamic bend performance, and reduced wiring complexity.
Explore Solution
Metal-Core PCB
Thermal-intensive PCB fabrication and assembly for LED power, high-current, automotive lighting, and industrial electronics requiring efficient heat dissipation.
Explore SolutionCapabilities & Manufacturing Limits FAQ
Technical answers to common engineering questions regarding this capability, inspection flow, and delivery expectations.
第一个问题 What quality standards guide XinshunPCB production? + -
Our work is guided by disciplined process control, customer requirements, and the quality systems needed for reliable PCB and PCBA delivery.
二季度 How do you keep lead times stable during supply fluctuations? + -
We protect lead times with planning, sourcing visibility, approved alternates, and early communication when constrained parts need attention.
Q3 Why is traceability important in PCB manufacturing? + -
Traceability links materials, process steps, and inspections so quality events can be found quickly and root causes can be isolated with confidence.
第四题 How do you balance cost and performance in stackup selection? + -
We compare signal, thermal, and reliability needs against material and layer cost, then choose the simplest stackup that still meets the spec.
问题五 What should a production-ready PCB design review include? + -
A production-ready review should check stackup, spacing, drill data, polarity, assembly fit, test access, and any special reliability requirements.
问题六 How do you control warpage on large or thin PCBs? + -
We manage warpage with balanced stackups, careful lamination, panel planning, and process rules that reduce mechanical stress.
Ready to Power Your Next Commercial Project?
Request a tailored technical proposal or custom pricing index today. Our engineering experts will review your specifications and respond within 24 hours with actionable topology blueprints.
100% NDA & Privacy Guaranteed
Your commercial inquiries, project blueprints, and intellectual property are fully protected by strict confidentiality compliance.
24-Hour R&D Engineer Alignment
Skip the basic customer service. Your technical specifications are directly evaluated by Xinshun’s senior R&D and system architecture teams.
Factory-Direct Commercial Advantage
Gain direct access to source manufacturing pricing, rigorous 24/7 full-load aging tests, and full life-cycle tech support.