We use 4oz to 10oz heavy copper, high-TG substrates, thermal relief engineering, and validated heat-dissipation layouts to protect continuous-current power electronics under demanding load conditions.

We pair Rogers and other low-loss laminates with controlled stack-up design, coupon verification, and PCB field-solver validation to keep impedance within tight tolerance windows.

Rigid-flex and CCS FPC architectures reduce cable bulk, improve assembly repeatability, lower connector failure points, and increase reliability in compact automotive and mobility systems.

We source through franchised channels, verify incoming lots against BOM data, and maintain full traceability across procurement, warehouse, and assembly stages to block counterfeit risk.

Typical NDT coverage includes automated optical inspection, flying probe testing, X-ray inspection for hidden solder joints, and final quality signoff before shipment.