SPI checks solder-paste deposits before placement, while AOI inspects visible assembly features. X-ray helps assess hidden solder joints that optical inspection cannot see. ICT checks accessible circuit nodes and components; functional testing evaluates defined operating behavior using suitable fixtures and firmware. These methods provide different coverage, so the test plan should specify which are required, their limits, sampling or coverage, and the records to be supplied.

Provide the panel outline, tooling holes, fiducials, edge clearances, component heights, and the population on both sides. Large or thin boards may need support tooling to control deflection during printing and placement. The assembly sequence must account for component mass, thermal exposure, and second-side reflow. Confirm handling limits and panel design before releasing production data.

Package size alone does not determine assembly feasibility. Review the land pattern, solder-mask openings, stencil thickness and apertures, paste release, board flatness, component packaging, and reflow limits together. BGA and other hidden-joint packages also need an agreed inspection strategy. Final package and pitch limits should be confirmed against the actual design rather than inferred from a headline capability value.

State which parts XinshunPCB should source and which you will supply. For supplied parts, identify quantities, packaging, moisture-sensitivity handling, lot information, and allowances for setup or attrition. For sourced parts, list approved manufacturers and acceptable alternatives. Agree how shortages, substitutions, unused material, and traceability records will be handled before production.

Provide the BOM with manufacturer part numbers and reference designators, Gerber or ODB++ data, drill files, placement coordinates, and assembly drawings. Include board and panel dimensions, quantities, component sourcing preferences, polarity notes, and any approved alternatives. Add programming files, test procedures, coating or underfill requirements, and the target delivery schedule so XinshunPCB can review the complete build.

Provide Gerber or ODB++ data, drill files, the board outline, quantities, and fabrication notes. Include the metal base, dielectric thickness and thermal conductivity, copper weight, surface finish, mounting details, and thermal load if known. Specify electrical testing, Hi-pot voltage and duration, thermal or peel tests, and acceptance criteria. For assembly, include the BOM, placement data, and assembly drawings.

Metal-core designs can combine additional routing layers with a heat-spreading base, or use a dedicated direct thermal pad beneath a compatible component. These constructions need different stackups, isolation details, and manufacturing steps. Supply a cross-section and pad definitions so the routing, bonding, thermal path, and test requirements can be reviewed before the build is confirmed.

In a conventional insulated metal substrate, a dielectric separates the circuit copper from the conductive base. Hole walls, exposed edges, mounting screws, and clearances must also be considered. A direct thermal pad may connect a component heat slug to the base, so its electrical potential must be checked. Define the working voltage and Hi-pot test conditions instead of treating a breakdown-voltage figure as a continuous operating rating.

No. Thermal conductivity describes a material property, while the thermal resistance of the dielectric also depends on its thickness and heat-transfer area. Component packaging, copper spreading, interface materials, mounting pressure, and the external heat sink also influence operating temperature. Select the dielectric together with its insulation properties and validate the full thermal assembly.