6L, Rogers 4835 + Isola 370HR High Frequency High Speed Board
- Layer Count: 6 Layers
- Base Material: Rogers 4835 + Isola 370HR
- Application: High-Frequency High-Speed Electronics
Rigid PCB Manufacturing & Fabrication
Build high-reliability rigid PCBs with FR-4, high-Tg, halogen-free, controlled impedance, and heavy copper options for demanding electronics.
Rigid PCB Manufacturing & Fabrication
Build high-reliability rigid PCBs with FR-4, high-Tg, halogen-free, controlled impedance, and heavy copper options for demanding electronics.
Precision Rigid PCB Manufacturing
1-56 layers, FR-4, high-Tg, halogen-free, 3 mil line/space, up to 12 oz copper, and controlled impedance.
Rigid PCB
1-56 layers, FR-4, high-Tg, halogen-free, 3 mil line/space, up to 12 oz copper, and controlled impedance.
- IPC Class 3 quality for mission-critical electronics
- High-Tg, heavy copper and controlled impedance options
- Prototype through volume production with full traceability
Precision Rigid PCB Manufacturing Capabilities & Technical Limits
Review our manufacturing parameters and technical limits to verify your design tolerances before production.
Base Capability
| Parameter | Specification |
|---|---|
| Layer count | 1-56 layers |
| Line / space | 3 / 3 mil |
| Copper weight | Up to 12 oz |
| Materials | FR-4, high-Tg, halogen-free, metal-core |
Performance & Compliance
| Parameter | Specification |
|---|---|
| Surface finish | HASL, ENIG, OSP, immersion tin, immersion silver |
| Impedance | Controlled impedance stackup review available |
| Inspection | AOI, electrical test, X-ray and traceability |
| Production | Prototype, pilot and volume manufacturing |
Advanced & high-end flex processes
From simple single-layer flex to complex rigid-flex assemblies that bend, shield and survive millions of cycles.
Rigid-flex integration
Rigid sections and flexible tails in one board, eliminating connectors, saving space and boosting reliability.
2-32 layers
Multilayer & HDI flex
Multilayer flex with laser microvias and fine lines for dense, high-pin-count flexible interconnects.
Microvia
Dynamic flexing
Bend-to-install or continuous-flex designs engineered with rolled-annealed copper and optimized bend radius.
Millions of cycles
EMI shielding film
Conductive shielding film over flex circuits for noise-sensitive and high-frequency applications.
Shielded flex
Stiffeners & ZIF contacts
Selective stiffeners and bevelled gold ZIF / contact fingers for connector insertion and component areas.
FR4 · PI · steel
Controlled impedance
Impedance-controlled flex and rigid-flex with stackup design support and TDR verification.
Microstrip / striplinePCB Capability Families: Core Manufacturing Solutions
Rigid, flex, rigid-flex, HDI, metal-core, and SMT production lines cover a broad range of PCB and PCBA needs.
Metal-Core PCB
Thermal-intensive PCB solutions built for LED power, high-current, and heat-dissipation applications.
Explore Solutions
Rigid-Flex PCB
Compact rigid-flex solutions for space-constrained electronics requiring dynamic bend reliability.
Explore Solutions
Industrial & Power Electronics
High-power BMS, energy storage, and industrial control solutions engineered with heavy copper, high-voltage creepage control, and high-TG materials.
Explore Solutions
Telecommunications & IoT
High-frequency PCB and PCBA solutions for RF, 5G, networking, and connected devices.
Explore Solutions
Medical Equipment
Medical-grade PCB and PCBA solutions built for traceability, reliability, and strict quality control.
Explore Solutions
Automotive Electronic
Automotive PCB and PCBA solutions designed for vibration, thermal cycling, and long-life reliability.
Explore SolutionsFAQ
Get quick answers about PCB materials, manufacturing tolerances, testing, assembly and production readiness.
Standard rigid PCB is suitable for general electronics, while high-Tg materials provide improved thermal stability for high-power, automotive, industrial and other demanding applications.
Knowledge Hub: Rigid PCB Engineering Insights
Stay ahead of the curve with technical deep-dives, design rules, and process optimization guides for rigid PCB production.
Full Turnkey PCBA with Traceable Component Sourcing
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Micro-BGA Reflow Tuning to Reduce Solder Voids
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Any-Layer HDI Reliability for Fine-Pitch BGAs
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Tight Impedance Control for Rogers RF PCB Stackups
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DFM Checklist for High-Mix PCB Builds
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Thermal Planning for Industrial Power PCB Designs
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High-Speed Signal Integrity in Multilayer PCB Stackups
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On-Time Delivery Metrics for High-Mix PCB Assembly
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PCB Design Review Notes Before Moving to Production
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